Low temperature transfer of carbon nanotube for large scale electronic assembly

• Main Author: Lau, Sien Cong
• Other Authors: Tay Beng Kang
• Format: Final Year Project
• Language: English
• Published: 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/74313
• Institution: Nanyang Technological University

Carbon nanotube (CNT) has been well-known since its discovery owing to its unique properties such as high thermal conductivity, mechanical and electrical properties. This material has the desired properties to be used in many electronic devices. Although vertically aligned carbon nanotubes (CNT) have been proposed for many applications in electronics, the high CNT synthesis temperature and the poor adhesion between the synthesized CNTs and supporting substrates have greatly restricted the application of CNTs in electronic. This project aims to research and develop a simple, cost effective and scalable transfer technique of CNTs onto any rigid and/or flexible substrate in a low-temperature environment. A mask-less transfer technique which incorporates a programmable dispensing system in depositing conductive adhesive materials with designed micro-pattern onto a targeted substrate was proposed. Various factors affecting the resolution of the printed pattern as well as the application of the transferred CNTs pattern in electronic devices (e.g. multi-layer deposition) were investigated. Contact transfer of CNTs was tested using a laboratory set up and a flip chip bonder and CNTs has successfully transferred. The morphologies and physical properties of the transferred CNTs were then studied.