Early product learning

The Early Product Learning (EPL) was designed to improve the yield for ICs by understanding the current reject trends and thus minimize the customer return spills. This project mainly focuses on the analysis of electrical failure. There are mainly four main phases in every failure analysis project....

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Main Author: Chandran, Karthik
Other Authors: Zhou Xing
Format: Theses and Dissertations
Language:English
Published: 2018
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Online Access:http://hdl.handle.net/10356/76083
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-760832023-07-04T15:39:54Z Early product learning Chandran, Karthik Zhou Xing School of Electrical and Electronic Engineering Technical University of Munich DRNTU::Engineering::Electrical and electronic engineering The Early Product Learning (EPL) was designed to improve the yield for ICs by understanding the current reject trends and thus minimize the customer return spills. This project mainly focuses on the analysis of electrical failure. There are mainly four main phases in every failure analysis project. The first phase is non-destructive analysis where the analyst receive the reject sample and perform analysis such as external visual inspection, X ray imaging, acoustic imaging etc. which helps to learn as much about the sample without altering it in anyway. The next phase is the defect localization. Here the analyst replicates the failing condition reported by the customer. Without localizing the failure, the project cannot continue, since there is no evidence to show that a defect even exists. Once the fault is confirmed, the next phase is fault isolation, where the analyst do an in-depth destructive physical analysis and examination. Finally, destructive analysis and documentation which serve as the culmination of all the data collection from which an analyst will perform delayering, a cross-section, or other destructive technique to reveal the defect in its entirety and identify its most likely cause. Various advanced semiconductor failure analysis techniques were used, including Scanning Electron Microscopy (SEM), Energy-Dispersive X-ray spectroscopy (EDX), Curve Tracer, Scanning Acoustic Topography (SAT) and X-ray inspection among others to isolate the root cause of electrical failure in multiple types of devices based on varied process technologies. Master of Science (Green Electronics) 2018-10-24T03:44:10Z 2018-10-24T03:44:10Z 2018 Thesis http://hdl.handle.net/10356/76083 en 81 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Chandran, Karthik
Early product learning
description The Early Product Learning (EPL) was designed to improve the yield for ICs by understanding the current reject trends and thus minimize the customer return spills. This project mainly focuses on the analysis of electrical failure. There are mainly four main phases in every failure analysis project. The first phase is non-destructive analysis where the analyst receive the reject sample and perform analysis such as external visual inspection, X ray imaging, acoustic imaging etc. which helps to learn as much about the sample without altering it in anyway. The next phase is the defect localization. Here the analyst replicates the failing condition reported by the customer. Without localizing the failure, the project cannot continue, since there is no evidence to show that a defect even exists. Once the fault is confirmed, the next phase is fault isolation, where the analyst do an in-depth destructive physical analysis and examination. Finally, destructive analysis and documentation which serve as the culmination of all the data collection from which an analyst will perform delayering, a cross-section, or other destructive technique to reveal the defect in its entirety and identify its most likely cause. Various advanced semiconductor failure analysis techniques were used, including Scanning Electron Microscopy (SEM), Energy-Dispersive X-ray spectroscopy (EDX), Curve Tracer, Scanning Acoustic Topography (SAT) and X-ray inspection among others to isolate the root cause of electrical failure in multiple types of devices based on varied process technologies.
author2 Zhou Xing
author_facet Zhou Xing
Chandran, Karthik
format Theses and Dissertations
author Chandran, Karthik
author_sort Chandran, Karthik
title Early product learning
title_short Early product learning
title_full Early product learning
title_fullStr Early product learning
title_full_unstemmed Early product learning
title_sort early product learning
publishDate 2018
url http://hdl.handle.net/10356/76083
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