Machine learning driven thickness detection in 2D materials

In recent times, two-dimensional (2D) materials have attracted significant attention and revolutionized various electronic device applications due to their heterostructure and unique properties not found in their bulk counterparts. However, the lack of large-scale area characterizing methods of accu...

Full description

Saved in:
Bibliographic Details
Main Author: Chen, Douglas Yuanhao
Other Authors: Liu Zheng
Format: Final Year Project
Language:English
Published: 2019
Subjects:
Online Access:http://hdl.handle.net/10356/76702
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:In recent times, two-dimensional (2D) materials have attracted significant attention and revolutionized various electronic device applications due to their heterostructure and unique properties not found in their bulk counterparts. However, the lack of large-scale area characterizing methods of accurate and intelligent detection of 2D nanostructures has hindered the rapid development of 2D materials. Thus, a more time efficient and accurate method is required. In this research, we have implemented the combination of machine learning and optical detection of 2D materials and its nanostructures with accurate predictions of certain MoS2 layers. Machine- learning optical identification (MOI) was established to realize accurate predictions of optical microscope images using RGB information of these 2D materials and their nanostructure. The results have proven that the MOI method is efficient in accurate characterizations of the thickness of large-scale area molybdenum disulfide (MoS2) impurities, as well as the identification of adhesive present during the mechanical exfoliation process in the sample preparation stage. With the successful implementation of AI and nanoscience, machine learning driven thickness detection in 2D materials can certainly drive further fundamental research in the 2D material and its wafer- scale device application space.