Anti-heat transfer label
For the past decades, shape memory polymers have been developed extensively and become more significant in the industry today. It is a smart material that encompasses the ability to return from a deformed state to its original state with the help of a trigger. The trigger could be heat, light, magne...
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2019
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| Online Access: | http://hdl.handle.net/10356/77871 |
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sg-ntu-dr.10356-778712023-03-04T19:37:32Z Anti-heat transfer label Thian, Hui Ning Huang Weimin School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering For the past decades, shape memory polymers have been developed extensively and become more significant in the industry today. It is a smart material that encompasses the ability to return from a deformed state to its original state with the help of a trigger. The trigger could be heat, light, magnetic field, chemical and electricity. In this report, heat triggered shape memory polymer would be tested and discussed. The purpose of this study is to create an anti-heat transfer label that can be incorporated in the current void label, to act as a failsafe layer should heat is used to tamper the label. Bachelor of Engineering (Mechanical Engineering) 2019-06-07T05:25:16Z 2019-06-07T05:25:16Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/77871 en Nanyang Technological University 58 p. application/pdf |
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NTU Library |
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Asia |
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Singapore Singapore |
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English |
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DRNTU::Engineering::Mechanical engineering |
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DRNTU::Engineering::Mechanical engineering Thian, Hui Ning Anti-heat transfer label |
| description |
For the past decades, shape memory polymers have been developed extensively and become more significant in the industry today. It is a smart material that encompasses the ability to return from a deformed state to its original state with the help of a trigger. The trigger could be heat, light, magnetic field, chemical and electricity. In this report, heat triggered shape memory polymer would be tested and discussed. The purpose of this study is to create an anti-heat transfer label that can be incorporated in the current void label, to act as a failsafe layer should heat is used to tamper the label. |
| author2 |
Huang Weimin |
| author_facet |
Huang Weimin Thian, Hui Ning |
| format |
Final Year Project |
| author |
Thian, Hui Ning |
| author_sort |
Thian, Hui Ning |
| title |
Anti-heat transfer label |
| title_short |
Anti-heat transfer label |
| title_full |
Anti-heat transfer label |
| title_fullStr |
Anti-heat transfer label |
| title_full_unstemmed |
Anti-heat transfer label |
| title_sort |
anti-heat transfer label |
| publishDate |
2019 |
| url |
http://hdl.handle.net/10356/77871 |
| _version_ |
1759857973473050624 |