Structural flexible hybrid electronics for embedded sensors and functionality

There have been many works of automated 3D hybrid manufacturing with various aspects of it to be improved on. This paper focus on the aspect of micro-dispensing and aims to develop it further by applying the automated integrated technology on the miniaturization of electronic circuits. This aim of t...

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Main Author: Ang, Leh Shuen
Other Authors: Zhong Zhaowei
Format: Final Year Project
Language:English
Published: 2019
Subjects:
Online Access:http://hdl.handle.net/10356/78575
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-785752023-03-04T18:36:34Z Structural flexible hybrid electronics for embedded sensors and functionality Ang, Leh Shuen Zhong Zhaowei School of Mechanical and Aerospace Engineering A*STAR Singapore Institute of Manufacturing Technology DRNTU::Engineering::Mechanical engineering There have been many works of automated 3D hybrid manufacturing with various aspects of it to be improved on. This paper focus on the aspect of micro-dispensing and aims to develop it further by applying the automated integrated technology on the miniaturization of electronic circuits. This aim of this research is to identify factors that will help the industry consistently produce a narrow and linear conductive trace by changing the width of the trace and eliminating the gaps in traces. This research will also focus and analyse on how changes in the parameters of identified factors can affect and give different outcomes. In the experiments, the average diameter size of individual points is used to gauge the width of the trace whereas the maximum gap size is used to detect the presence of gaps in the trace. The experimental results obtained show that a higher dispensing height and lower extrusion time will produce a narrow and linear conductive trace with zero gaps. The significance of each factors on the average diameter size and maximum gap size is scientifically proven through analysis of variance. Much research is still needed to fully identify and understand the contributing variables. It is hoped that, with this research paper, researchers gain more information regarding micro-dispensing for miniaturization. Bachelor of Engineering (Mechanical Engineering) 2019-06-24T02:49:04Z 2019-06-24T02:49:04Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/78575 en Nanyang Technological University 74 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Ang, Leh Shuen
Structural flexible hybrid electronics for embedded sensors and functionality
description There have been many works of automated 3D hybrid manufacturing with various aspects of it to be improved on. This paper focus on the aspect of micro-dispensing and aims to develop it further by applying the automated integrated technology on the miniaturization of electronic circuits. This aim of this research is to identify factors that will help the industry consistently produce a narrow and linear conductive trace by changing the width of the trace and eliminating the gaps in traces. This research will also focus and analyse on how changes in the parameters of identified factors can affect and give different outcomes. In the experiments, the average diameter size of individual points is used to gauge the width of the trace whereas the maximum gap size is used to detect the presence of gaps in the trace. The experimental results obtained show that a higher dispensing height and lower extrusion time will produce a narrow and linear conductive trace with zero gaps. The significance of each factors on the average diameter size and maximum gap size is scientifically proven through analysis of variance. Much research is still needed to fully identify and understand the contributing variables. It is hoped that, with this research paper, researchers gain more information regarding micro-dispensing for miniaturization.
author2 Zhong Zhaowei
author_facet Zhong Zhaowei
Ang, Leh Shuen
format Final Year Project
author Ang, Leh Shuen
author_sort Ang, Leh Shuen
title Structural flexible hybrid electronics for embedded sensors and functionality
title_short Structural flexible hybrid electronics for embedded sensors and functionality
title_full Structural flexible hybrid electronics for embedded sensors and functionality
title_fullStr Structural flexible hybrid electronics for embedded sensors and functionality
title_full_unstemmed Structural flexible hybrid electronics for embedded sensors and functionality
title_sort structural flexible hybrid electronics for embedded sensors and functionality
publishDate 2019
url http://hdl.handle.net/10356/78575
_version_ 1759856608911818752