Submerge impingement cooling for the high thermal flux electric board

Mankind has developed throughout the years, from people living in caves and hunting for food using primitive tools to living in high-rise buildings and surrounded with many man-made luxurious items. This rapid growth in technology has sparked many studies that are impossible to be performed in the p...

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Main Author: Ge, Yong An
Other Authors: Fei Duan
Format: Final Year Project
Language:English
Published: 2019
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Online Access:http://hdl.handle.net/10356/78772
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-787722023-03-04T18:30:02Z Submerge impingement cooling for the high thermal flux electric board Ge, Yong An Fei Duan School of Mechanical and Aerospace Engineering Engineering::Mechanical engineering Mankind has developed throughout the years, from people living in caves and hunting for food using primitive tools to living in high-rise buildings and surrounded with many man-made luxurious items. This rapid growth in technology has sparked many studies that are impossible to be performed in the past to now being achievable through modern tools. With the recent trend in implementation of nanotechnology, components can now be packed in a more compact manner, hence, reducing the size of many products. However, a coin always has two sides and there are many limitations. Having the ability to be compacted in to a small product leads to a smaller surface area for the dissipation of heat, allowing immense building up of heat to take place. This immense building up of heat increases the temperature of the product, which may result in a significance drop in efficiency and even exceed the melting point of the product, resulting in dire consequences. Therefore, many researches and studies focus on searching for alternatives to better dissipate heat through improving the rate of heat transfer and preventing occurrence of undesired outcomes. The experimental investigations show that direct attention to immersion cooling and submerged jet impingement cooling techniques. Submerged jet outlet velocity, working fluid temperature, submerged jet outlet temperature and nozzle diameter variations are few of the various parameters being examined to determine the relationship they have with the heat flux. The experiments are carried out on the surface of a copper test specimen that is polished with abrasive grinding paper of grit value P2400, where the encounters of bubble formation and the encounter of Critical Heat Flux are being recorded. Further studies on the pattern and arrangement of the jet array for the submerged jet impingement would be greatly anticipated in determining the best pattern and arrangement for submerged jet array impingement. Bachelor of Engineering (Mechanical Engineering) 2019-06-27T01:25:41Z 2019-06-27T01:25:41Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/78772 en Nanyang Technological University 64 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Ge, Yong An
Submerge impingement cooling for the high thermal flux electric board
description Mankind has developed throughout the years, from people living in caves and hunting for food using primitive tools to living in high-rise buildings and surrounded with many man-made luxurious items. This rapid growth in technology has sparked many studies that are impossible to be performed in the past to now being achievable through modern tools. With the recent trend in implementation of nanotechnology, components can now be packed in a more compact manner, hence, reducing the size of many products. However, a coin always has two sides and there are many limitations. Having the ability to be compacted in to a small product leads to a smaller surface area for the dissipation of heat, allowing immense building up of heat to take place. This immense building up of heat increases the temperature of the product, which may result in a significance drop in efficiency and even exceed the melting point of the product, resulting in dire consequences. Therefore, many researches and studies focus on searching for alternatives to better dissipate heat through improving the rate of heat transfer and preventing occurrence of undesired outcomes. The experimental investigations show that direct attention to immersion cooling and submerged jet impingement cooling techniques. Submerged jet outlet velocity, working fluid temperature, submerged jet outlet temperature and nozzle diameter variations are few of the various parameters being examined to determine the relationship they have with the heat flux. The experiments are carried out on the surface of a copper test specimen that is polished with abrasive grinding paper of grit value P2400, where the encounters of bubble formation and the encounter of Critical Heat Flux are being recorded. Further studies on the pattern and arrangement of the jet array for the submerged jet impingement would be greatly anticipated in determining the best pattern and arrangement for submerged jet array impingement.
author2 Fei Duan
author_facet Fei Duan
Ge, Yong An
format Final Year Project
author Ge, Yong An
author_sort Ge, Yong An
title Submerge impingement cooling for the high thermal flux electric board
title_short Submerge impingement cooling for the high thermal flux electric board
title_full Submerge impingement cooling for the high thermal flux electric board
title_fullStr Submerge impingement cooling for the high thermal flux electric board
title_full_unstemmed Submerge impingement cooling for the high thermal flux electric board
title_sort submerge impingement cooling for the high thermal flux electric board
publishDate 2019
url http://hdl.handle.net/10356/78772
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