Tensor decomposition based R-dimensional matrix pencil method
In this paper, we extend the standard matrix pencil (MP) method to R-dimensional (R-D) tensor based MP. Higher-order singular value decomposition (HOSVD) is used to obtain the signal subspace. Performance of tensor based MP method is evaluated by computer simulations. Comparing with the conventional...
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sg-ntu-dr.10356-799062019-12-06T13:36:30Z Tensor decomposition based R-dimensional matrix pencil method Wen, Fuxi Tay, Wee Peng School of Electrical and Electronic Engineering International Conference on Information Fusion (15th : 2012 : Singapore) DRNTU::Engineering::Electrical and electronic engineering In this paper, we extend the standard matrix pencil (MP) method to R-dimensional (R-D) tensor based MP. Higher-order singular value decomposition (HOSVD) is used to obtain the signal subspace. Performance of tensor based MP method is evaluated by computer simulations. Comparing with the conventional matrix based MP methods, better performance is obtained for tensor based R-D MP methods by exploiting the structure of the measurement data. Furthermore, it is straightforward to extend the proposed R-D tensor MP to other MP type methods, such as R-D unitary tensor MP, R-D beamspace tensor MP. Published version 2012-10-12T07:41:19Z 2019-12-06T13:36:30Z 2012-10-12T07:41:19Z 2019-12-06T13:36:30Z 2012 2012 Conference Paper Wen, F., & Tay, W. P. (2012). Tensor decomposition based R-dimensional matrix pencil method. 15th International Conference on Information Fusion (FUSION), 2012, pp.1712-1717. https://hdl.handle.net/10356/79906 http://hdl.handle.net/10220/8768 http://ieeexplore.ieee.org/xpl/articleDetails.jsp;jsessionid=Q8SWQQXL4TNfbzZgpD25Wg8ky21Jw2VHhMJ1hhJgcb5D2pJP1X2y!-1489032362?arnumber=6290509&contentType=Conference+Publications 164588 en © 2012 ISIF. This paper was published in 15th International Conference on Information Fusion (FUSION) and is made available as an electronic reprint (preprint) with permission of ISIF. The paper can be found at the following official URL: [http://ieeexplore.ieee.org/xpl/articleDetails.jsp;jsessionid=Q8SWQQXL4TNfbzZgpD25Wg8ky21Jw2VHhMJ1hhJgcb5D2pJP1X2y!-1489032362?arnumber=6290509&contentType=Conference+Publications]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering Wen, Fuxi Tay, Wee Peng Tensor decomposition based R-dimensional matrix pencil method |
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In this paper, we extend the standard matrix pencil (MP) method to R-dimensional (R-D) tensor based MP. Higher-order singular value decomposition (HOSVD) is used to obtain the signal subspace. Performance of tensor based MP method is evaluated by computer simulations. Comparing with the conventional matrix based MP methods, better performance is obtained for tensor based R-D MP methods by exploiting the structure of the measurement data. Furthermore, it is straightforward to extend the proposed R-D tensor MP to other MP type methods, such as R-D unitary tensor MP, R-D beamspace tensor MP. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Wen, Fuxi Tay, Wee Peng |
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Conference or Workshop Item |
author |
Wen, Fuxi Tay, Wee Peng |
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Wen, Fuxi |
title |
Tensor decomposition based R-dimensional matrix pencil method |
title_short |
Tensor decomposition based R-dimensional matrix pencil method |
title_full |
Tensor decomposition based R-dimensional matrix pencil method |
title_fullStr |
Tensor decomposition based R-dimensional matrix pencil method |
title_full_unstemmed |
Tensor decomposition based R-dimensional matrix pencil method |
title_sort |
tensor decomposition based r-dimensional matrix pencil method |
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2012 |
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https://hdl.handle.net/10356/79906 http://hdl.handle.net/10220/8768 http://ieeexplore.ieee.org/xpl/articleDetails.jsp;jsessionid=Q8SWQQXL4TNfbzZgpD25Wg8ky21Jw2VHhMJ1hhJgcb5D2pJP1X2y!-1489032362?arnumber=6290509&contentType=Conference+Publications |
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