APA引文

Ping, J., Gao, F., Chen, J. L., Webster, R. D., Steele, T. W. J., & Engineering, S. o. M. S. &. (2017). Adhesive curing through low-voltage activation.

Chicago Style Citation

Ping, Jianfeng, Feng Gao, Jian Lin Chen, Richard David Webster, Terry W. J. Steele, and School of Materials Science & Engineering. Adhesive Curing Through Low-voltage Activation. 2017.

MLA引文

Ping, Jianfeng, et al. Adhesive Curing Through Low-voltage Activation. 2017.