Adhesive curing through low-voltage activation

• المؤلفون الرئيسيون: Ping, Jianfeng, Gao, Feng, Chen, Jian Lin, Webster, Richard David, Steele, Terry W. J.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2017
• الموضوعات: Adhesive agent; Dendrimer
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/80593; http://hdl.handle.net/10220/42177

Instant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development...