Adhesive curing through low-voltage activation

• Main Authors: Ping, Jianfeng, Gao, Feng, Chen, Jian Lin, Webster, Richard David, Steele, Terry W. J.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2017
• Subjects: Adhesive agent; Dendrimer
• Online Access: https://hdl.handle.net/10356/80593; http://hdl.handle.net/10220/42177
• Institution: Nanyang Technological University

Instant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development...