Adhesive curing through low-voltage activation

• Main Authors: Ping, Jianfeng, Gao, Feng, Chen, Jian Lin, Webster, Richard David, Steele, Terry W. J.
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2017
• 主題: Adhesive agent; Dendrimer
• 在線閱讀: https://hdl.handle.net/10356/80593; http://hdl.handle.net/10220/42177
• 機構: Nanyang Technological University

Instant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development...