A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications

Ring oscillator (RO) based physical unclonable function (PUF) is resilient against noise impacts, but its response is susceptible to temperature variations. This paper presents a low-power and small footprint hybrid RO PUF with a very high temperature stability, which makes it an ideal candidate...

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Main Authors: Cao, Yuan, Zhang, Le, Chang, Chip-Hong, Chen, Shoushun
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2015
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Online Access:https://hdl.handle.net/10356/81334
http://hdl.handle.net/10220/39237
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-813342021-01-10T11:03:17Z A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications Cao, Yuan Zhang, Le Chang, Chip-Hong Chen, Shoushun School of Electrical and Electronic Engineering Energy Research Institute @ NTU (ERI@N) Hardware security Physical unclonable function (PUF) Process variation Ring oscillator (RO) Temperature stability Ring oscillator (RO) based physical unclonable function (PUF) is resilient against noise impacts, but its response is susceptible to temperature variations. This paper presents a low-power and small footprint hybrid RO PUF with a very high temperature stability, which makes it an ideal candidate for lightweight applications. The negative temperature coefficient of the low-power subthreshold operation of current starved inverters is exploited to mitigate the variations of differential RO frequencies with temperature. The new architecture uses conspicuously simplified circuitries to generate and compare a large number of pairs of RO frequencies. The proposed 9- stage hybrid RO PUF was fabricated using GF 65 nm CMOS technology. The PUF occupies only 250 m2 of chip area and consumes only 32.3 W per CRP at 1.2 V and 230 MHz. The measured average and worst-case reliability of its responses are 99.84% and 97.28%, respectively over a wide range of temperature from 40 to 120 ◦C. MOE (Min. of Education, S’pore) Accepted version 2015-12-30T01:52:15Z 2019-12-06T14:28:40Z 2015-12-30T01:52:15Z 2019-12-06T14:28:40Z 2015 Journal Article Cao, Y., Zhang, L., Chang, C.-H., & Chen, S. (2015). A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 34(7), 1143-1147. 0278-0070 https://hdl.handle.net/10356/81334 http://hdl.handle.net/10220/39237 10.1109/TCAD.2015.2424955 en IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [http://dx.doi.org/10.1109/TCAD.2015.2424955]. 5 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Hardware security
Physical unclonable function (PUF)
Process variation
Ring oscillator (RO)
Temperature stability
spellingShingle Hardware security
Physical unclonable function (PUF)
Process variation
Ring oscillator (RO)
Temperature stability
Cao, Yuan
Zhang, Le
Chang, Chip-Hong
Chen, Shoushun
A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
description Ring oscillator (RO) based physical unclonable function (PUF) is resilient against noise impacts, but its response is susceptible to temperature variations. This paper presents a low-power and small footprint hybrid RO PUF with a very high temperature stability, which makes it an ideal candidate for lightweight applications. The negative temperature coefficient of the low-power subthreshold operation of current starved inverters is exploited to mitigate the variations of differential RO frequencies with temperature. The new architecture uses conspicuously simplified circuitries to generate and compare a large number of pairs of RO frequencies. The proposed 9- stage hybrid RO PUF was fabricated using GF 65 nm CMOS technology. The PUF occupies only 250 m2 of chip area and consumes only 32.3 W per CRP at 1.2 V and 230 MHz. The measured average and worst-case reliability of its responses are 99.84% and 97.28%, respectively over a wide range of temperature from 40 to 120 ◦C.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Cao, Yuan
Zhang, Le
Chang, Chip-Hong
Chen, Shoushun
format Article
author Cao, Yuan
Zhang, Le
Chang, Chip-Hong
Chen, Shoushun
author_sort Cao, Yuan
title A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
title_short A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
title_full A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
title_fullStr A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
title_full_unstemmed A Low-Power Hybrid RO PUF With Improved Thermal Stability for Lightweight Applications
title_sort low-power hybrid ro puf with improved thermal stability for lightweight applications
publishDate 2015
url https://hdl.handle.net/10356/81334
http://hdl.handle.net/10220/39237
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