Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

• المؤلفون الرئيسيون: Han, Yong, Lau, Boon Long, Zhang, Xiaowu, Leong, Yoke Choy, Choo, Kok Fah
• مؤلفون آخرون: Temasek Laboratories
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Diamonds; Heat sinks; Heating; Logic gates; Microchannel; Silicon
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/81448; http://hdl.handle.net/10220/40786
• المؤسسة: Nanyang Technological University

The diamond heat spreader has been directly attached between the test chip and the Cu microchannel heat sink for thermal performance enhancement of the GaN-on-Si device. In the fabricated test vehicle, the small heater is used to represent one unit of transistor. Experimental tests have been conduct...