Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

• Main Authors: Han, Yong, Lau, Boon Long, Zhang, Xiaowu, Leong, Yoke Choy, Choo, Kok Fah
• Other Authors: Temasek Laboratories
• Format: Article
• Language: English
• Published: 2016
• Subjects: Electronic cooling; heat dissipation capability; high-electron mobility transistor (HEMT); hotspot; microchannel heat sink (MCHS); microjet impingement
• Online Access: https://hdl.handle.net/10356/81472; http://hdl.handle.net/10220/40787
• Institution: Nanyang Technological University

The direct-die-attached cooling solution with a diamond heat spreader and hybrid Si heat sink has been developed for hotspot cooling of a GaN-on-Si device. The hybrid heat sink combines the benefits of microchannel flow and microjet impingement. In the fabricated test chip, the small hotspot is used...