Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device
The diamond heat spreader has been directly attached between the test chip and the Cu microchannel heat sink for thermal performance enhancement of the GaN-on-Si device. In the fabricated test vehicle, the small heater is used to represent one unit of transistor. Experimental tests have been conduct...
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| Main Authors: | , , , , |
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| 格式: | Article |
| 語言: | English |
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2016
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| 在線閱讀: | https://hdl.handle.net/10356/81448 http://hdl.handle.net/10220/40786 |
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