Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors

• Main Authors: Wang, Zongrui, Dong, Huanli, Zou, Ye, Zhao, Qiang, Tan, Jiahui, Liu, Jie, Lu, Xiuqiang, Xiao, Jinchong, Zhang, Qichun, Hu, Wenping
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2017
• 主題: Bottom-contact Organic Field-effect Transistor; Contact Resistance
• 在線閱讀: https://hdl.handle.net/10356/83724; http://hdl.handle.net/10220/42773

Poor charge injection and transport at the electrode/semiconductor contacts has been so far a severe performance hurdle for bottom-contact bottom-gate (BCBG) organic field-effect transistors (OFETs). Here, we have developed a simple, economic, and effective method to improve the carrier injection ef...