Palladium-coated and bare copper wire study for ultra-fine pitch wire bonding

• المؤلفون الرئيسيون: Lim, A. B. Y., Chang, A. C. K., Lee, C. X., Yauw, O., Chylak, B., Chen, Z.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/85269; http://hdl.handle.net/10220/10206

There is growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. Recently, palladium-coated copper (PdCu) wire has become widely u...