Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies

Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing...

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Main Authors: Saengchairat, Nitipon, Chua, Chee Kai, Tran, Tuan
Other Authors: School of Mechanical and Aerospace Engineering
Format: Conference or Workshop Item
Language:English
Published: 2018
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Online Access:https://hdl.handle.net/10356/88255
http://hdl.handle.net/10220/45705
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-882552020-09-24T20:12:58Z Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan School of Mechanical and Aerospace Engineering Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018) Singapore Centre for 3D Printing DRNTU::Engineering::Mechanical engineering::Prototyping Ink Evaporation Soft Substrates Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate materials, poor printing resolution, and lack of fundamental understanding on the deposition process of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e., micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation process depends on various contributing parameters such as liquid properties, surface wettability, roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has not been fully understood for soft substrates, which are relevant for fabrication of flexible and stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the electrical properties of the printed patterns can be manipulated. Published version 2018-08-29T02:13:09Z 2019-12-06T16:59:12Z 2018-08-29T02:13:09Z 2019-12-06T16:59:12Z 2018 Conference Paper Saengchairat, N., Chua, C. K., & Tran, T. (2018). Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 121-126. doi:10.25341/D46K5D https://hdl.handle.net/10356/88255 http://hdl.handle.net/10220/45705 10.25341/D46K5D en © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore. 6 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering::Prototyping
Ink Evaporation
Soft Substrates
spellingShingle DRNTU::Engineering::Mechanical engineering::Prototyping
Ink Evaporation
Soft Substrates
Saengchairat, Nitipon
Chua, Chee Kai
Tran, Tuan
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
description Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate materials, poor printing resolution, and lack of fundamental understanding on the deposition process of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e., micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation process depends on various contributing parameters such as liquid properties, surface wettability, roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has not been fully understood for soft substrates, which are relevant for fabrication of flexible and stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the electrical properties of the printed patterns can be manipulated.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Saengchairat, Nitipon
Chua, Chee Kai
Tran, Tuan
format Conference or Workshop Item
author Saengchairat, Nitipon
Chua, Chee Kai
Tran, Tuan
author_sort Saengchairat, Nitipon
title Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
title_short Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
title_full Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
title_fullStr Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
title_full_unstemmed Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
title_sort ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
publishDate 2018
url https://hdl.handle.net/10356/88255
http://hdl.handle.net/10220/45705
_version_ 1681058269879074816