Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies
Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing...
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sg-ntu-dr.10356-882552020-09-24T20:12:58Z Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan School of Mechanical and Aerospace Engineering Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018) Singapore Centre for 3D Printing DRNTU::Engineering::Mechanical engineering::Prototyping Ink Evaporation Soft Substrates Additive manufacturing (AM) has emerged in various fields including prototyping, construction, biomedical science, and electronic fabrication. For manufacturing of electronics, several AM techniques have been developed, most notably droplet-based techniques such as inkjet and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate materials, poor printing resolution, and lack of fundamental understanding on the deposition process of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e., micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation process depends on various contributing parameters such as liquid properties, surface wettability, roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has not been fully understood for soft substrates, which are relevant for fabrication of flexible and stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the electrical properties of the printed patterns can be manipulated. Published version 2018-08-29T02:13:09Z 2019-12-06T16:59:12Z 2018-08-29T02:13:09Z 2019-12-06T16:59:12Z 2018 Conference Paper Saengchairat, N., Chua, C. K., & Tran, T. (2018). Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 121-126. doi:10.25341/D46K5D https://hdl.handle.net/10356/88255 http://hdl.handle.net/10220/45705 10.25341/D46K5D en © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore. 6 p. application/pdf |
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DRNTU::Engineering::Mechanical engineering::Prototyping Ink Evaporation Soft Substrates Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
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Additive manufacturing (AM) has emerged in various fields including prototyping,
construction, biomedical science, and electronic fabrication. For manufacturing of electronics,
several AM techniques have been developed, most notably droplet-based techniques such as inkjet
and aerosol-jet printing. The progress in this field has been hindered due to the lack of appropriate
materials, poor printing resolution, and lack of fundamental understanding on the deposition process
of conductive materials. Typically for droplet-based printing, small droplets of a certain ink, i.e.,
micro- or nanoparticles suspended solvent, are ejected onto printed substrates. The ink droplets, after
deposited on a substrate, evaporate leaving behind particles on the substrate. The evaporation
process depends on various contributing parameters such as liquid properties, surface wettability,
roughness, and stiffness. While this process has been extensively studied for rigid substrate, it has
not been fully understood for soft substrates, which are relevant for fabrication of flexible and
stretchable electronics. In this work, we study the effect of substrate's elasticity on evaporation
process of suspension droplets. Variation in the elasticity plays a crucial role as it directly influences
the morphology of the substrate at the triple-phase contact line, thus resulting in different deposited
patterns of particles on the substrate. By fine-tuning the substract's elasticity, we expect that the
electrical properties of the printed patterns can be manipulated. |
author2 |
School of Mechanical and Aerospace Engineering |
author_facet |
School of Mechanical and Aerospace Engineering Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan |
format |
Conference or Workshop Item |
author |
Saengchairat, Nitipon Chua, Chee Kai Tran, Tuan |
author_sort |
Saengchairat, Nitipon |
title |
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
title_short |
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
title_full |
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
title_fullStr |
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
title_full_unstemmed |
Ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
title_sort |
ink evaporation on soft substrates for additive manufacturing of stretchable electronic devices : experimental studies |
publishDate |
2018 |
url |
https://hdl.handle.net/10356/88255 http://hdl.handle.net/10220/45705 |
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1681058269879074816 |