Band bending modification of inkjet-printed ZnO thin film for additive manufacturing of electronic devices

• Main Authors: Tran, Van Thai, Wei, Yuefan, Du, Hejun
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2018
• Subjects: Additive Manufacturing; Inkjet Printing; DRNTU::Engineering::Mechanical engineering::Prototyping
• Online Access: https://hdl.handle.net/10356/88303; http://hdl.handle.net/10220/45710
• Institution: Nanyang Technological University

Among different approaches for additive manufacturing of electronic devices, inkjet printing is a potential method because it is capable of fabricating multi-material devices with good resolution. Meanwhile, zinc oxide (ZnO) is a wide-bandgap semiconductor, and it is an interesting material for electronic, optoelectronic and gas sensing devices. Hence, inkjet printing of ZnO is an attractive approach for additive manufacturing of functional devices. Band bending, caused by the exchanging of electrons at the surface of the semiconductor, has a significant effect on the performance of semiconductor devices in general and ZnO-based devices in particular. In this work, we present the modification of band bending of inkjet-printed ZnO thin film using thermal annealing. The results show a potential approach to improve the performance of the printed electronic device.