Wideband sound absorption of 3D printed multi-layer micro-perforated panels

Micro-perforated panel (MPP) absorbers have been applied widely in noise reduction and sound damping. In order to obtain wideband sound absorption, novel structures of MPPs with various numbers of panel layers and spacing distances between them were designed. The structures were manufactured by s...

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Main Authors: Yang, Wenjing, Yuan, Shangqin, Zhou, Kun, Chua, Chee Kai
Other Authors: School of Mechanical and Aerospace Engineering
Format: Conference or Workshop Item
Language:English
Published: 2018
Subjects:
Online Access:https://hdl.handle.net/10356/88501
http://hdl.handle.net/10220/45851
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-885012020-09-24T20:11:43Z Wideband sound absorption of 3D printed multi-layer micro-perforated panels Yang, Wenjing Yuan, Shangqin Zhou, Kun Chua, Chee Kai School of Mechanical and Aerospace Engineering Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018) Singapore Centre for 3D Printing 3D Printing Additive Manufacturing DRNTU::Engineering::Mechanical engineering::Prototyping Micro-perforated panel (MPP) absorbers have been applied widely in noise reduction and sound damping. In order to obtain wideband sound absorption, novel structures of MPPs with various numbers of panel layers and spacing distances between them were designed. The structures were manufactured by selective laser sintering, which is an advanced 3D printing technique producing complex structures effectively. The sound absorption coefficients of MPPs were measured by the impedance tube method. The results suggested that the multi-layer structures significantly increased the bandwidths of the absorption compared to the single-layer MPPs. This research work demonstrates the large potential of artificial acoustic designs of MPP via 3D printing for wideband absorption through controlling the layer number and the spacing distance. Published version 2018-09-06T03:10:50Z 2019-12-06T17:04:38Z 2018-09-06T03:10:50Z 2019-12-06T17:04:38Z 2018 Conference Paper Yang, W., Yuan, S., Chua, C. K., & Zhou, K. (2018). Wideband sound absorption of 3D printed multi-layer micro-perforated panels. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (Pro-AM 2018), 370-375. doi:10.25341/D4C307 https://hdl.handle.net/10356/88501 http://hdl.handle.net/10220/45851 10.25341/D4C307 en © 2018 Nanyang Technological University. Published by Nanyang Technological University, Singapore. 6 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic 3D Printing
Additive Manufacturing
DRNTU::Engineering::Mechanical engineering::Prototyping
spellingShingle 3D Printing
Additive Manufacturing
DRNTU::Engineering::Mechanical engineering::Prototyping
Yang, Wenjing
Yuan, Shangqin
Zhou, Kun
Chua, Chee Kai
Wideband sound absorption of 3D printed multi-layer micro-perforated panels
description Micro-perforated panel (MPP) absorbers have been applied widely in noise reduction and sound damping. In order to obtain wideband sound absorption, novel structures of MPPs with various numbers of panel layers and spacing distances between them were designed. The structures were manufactured by selective laser sintering, which is an advanced 3D printing technique producing complex structures effectively. The sound absorption coefficients of MPPs were measured by the impedance tube method. The results suggested that the multi-layer structures significantly increased the bandwidths of the absorption compared to the single-layer MPPs. This research work demonstrates the large potential of artificial acoustic designs of MPP via 3D printing for wideband absorption through controlling the layer number and the spacing distance.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Yang, Wenjing
Yuan, Shangqin
Zhou, Kun
Chua, Chee Kai
format Conference or Workshop Item
author Yang, Wenjing
Yuan, Shangqin
Zhou, Kun
Chua, Chee Kai
author_sort Yang, Wenjing
title Wideband sound absorption of 3D printed multi-layer micro-perforated panels
title_short Wideband sound absorption of 3D printed multi-layer micro-perforated panels
title_full Wideband sound absorption of 3D printed multi-layer micro-perforated panels
title_fullStr Wideband sound absorption of 3D printed multi-layer micro-perforated panels
title_full_unstemmed Wideband sound absorption of 3D printed multi-layer micro-perforated panels
title_sort wideband sound absorption of 3d printed multi-layer micro-perforated panels
publishDate 2018
url https://hdl.handle.net/10356/88501
http://hdl.handle.net/10220/45851
_version_ 1681057181195042816