Electrical and thermal models of CNT TSV and graphite interface

• Main Authors: Vaisband, Boris, Maurice, Ange, Tan, Chong Wei, Tay, Beng Kang, Friedman, Eby G.
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2019
• 主題: DRNTU::Engineering::Electrical and electronic engineering; Carbon Nanotubes; 3-D IC
• 在線閱讀: https://hdl.handle.net/10356/90234; http://hdl.handle.net/10220/48534

Carbon nanotubes (CNTs) are a suitable replacement for metals commonly used as a fill material for through substrate vias (TSVs). The electrical and thermal contact resistance, however, between the CNT TSVs and the horizontal metal interconnects (typically copper) can limit the use of CNT technology...