APA استشهاد

Chen, J., Yao, C., Zhang, X., Sun, C. Q., Huang, Y., & Engineering, S. o. E. a. E. (2019). Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation.

استشهاد بنمط شيكاغو

Chen, Jiasheng, Chuang Yao, Xi Zhang, Chang Q. Sun, Yongli Huang, و School of Electrical and Electronic Engineering. Hydrogen Bond and Surface Stress Relaxation By Aldehydic and Formic Acidic Molecular Solvation. 2019.

MLA استشهاد

Chen, Jiasheng, et al. Hydrogen Bond and Surface Stress Relaxation By Aldehydic and Formic Acidic Molecular Solvation. 2019.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.