Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation

• Main Authors: Chen, Jiasheng, Yao, Chuang, Zhang, Xi, Sun, Chang Q., Huang, Yongli
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2019
• Subjects: Solvation; Hydrogen Bond; DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/90267; http://hdl.handle.net/10220/48501
• Institution: Nanyang Technological University

Solvation of aldehydes and formic acids has an important impact to health care because these additives can damage DNA and denature proteins causing cancers with the mechanism behind remaining great challenge. From the perspective of solvent hydrogen bond (O:HO or HB with “:” being the electron lone...