Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications

Antenna-on-chip (AoC) and antenna-in-package (AiP) solutions are studied for highly integrated millimeter-wave (mmWave) devices in wireless communications. First, the backgro...

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Main Authors: Zhang, Yue Ping, Liu, Duixian
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2010
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Online Access:https://hdl.handle.net/10356/91623
http://hdl.handle.net/10220/6234
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-916232020-03-07T14:02:41Z Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications Zhang, Yue Ping Liu, Duixian School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Antenna-on-chip (AoC) and antenna-in-package (AiP) solutions are studied for highly integrated millimeter-wave (mmWave) devices in wireless communications. First, the background, regulations, standard, and applications of 60-GHz wireless communications are briefly introduced. Then, highly integrated 60-GHz radios are overviewed as a basis for the link budget analysis to derive the antenna gain requirement. Next, in order to have deep physical insight into the AoC solution, the silicon substrate’s high permittivity and low resistivity effects on the AoC efficiency are examined. It is shown that the AoC solution has low efficiency, less than 12% due to large ohmic losses and surface waves, which requires the development of techniques to improve the AoC efficiency. After that, the AiP solution and associated challenges such as how to realize low-loss interconnection between the chip and antenna are addressed. It is shown that wire-bonding interconnects, although inferior to the flip-chip, are still feasible in the 60-GHz band if proper compensation schemes are utilized. An example of the AiP solution in a low-temperature cofired ceramic (LTCC) process is presented in the 60-GHz band showing an efficiency better than 90%. A major concern with both AoC and AiP solutions is electromagnetic interference (EMI), which is also discussed. Finally, the systems level pros and cons of both AoC and AiP solutions are highlighted from the electrical and economic perspectives for system designers. Published version 2010-04-15T00:41:18Z 2019-12-06T18:09:08Z 2010-04-15T00:41:18Z 2019-12-06T18:09:08Z 2009 2009 Journal Article Zhang, Y. P., & Liu, D. (2009). Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications. IEEE Transactions On Antennas And Propagation, 57(10), 2830-2841. 0018-926X https://hdl.handle.net/10356/91623 http://hdl.handle.net/10220/6234 10.1109/TAP.2009.2029295 en IEEE transactions on antennas and propagation © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 12 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Zhang, Yue Ping
Liu, Duixian
Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
description Antenna-on-chip (AoC) and antenna-in-package (AiP) solutions are studied for highly integrated millimeter-wave (mmWave) devices in wireless communications. First, the background, regulations, standard, and applications of 60-GHz wireless communications are briefly introduced. Then, highly integrated 60-GHz radios are overviewed as a basis for the link budget analysis to derive the antenna gain requirement. Next, in order to have deep physical insight into the AoC solution, the silicon substrate’s high permittivity and low resistivity effects on the AoC efficiency are examined. It is shown that the AoC solution has low efficiency, less than 12% due to large ohmic losses and surface waves, which requires the development of techniques to improve the AoC efficiency. After that, the AiP solution and associated challenges such as how to realize low-loss interconnection between the chip and antenna are addressed. It is shown that wire-bonding interconnects, although inferior to the flip-chip, are still feasible in the 60-GHz band if proper compensation schemes are utilized. An example of the AiP solution in a low-temperature cofired ceramic (LTCC) process is presented in the 60-GHz band showing an efficiency better than 90%. A major concern with both AoC and AiP solutions is electromagnetic interference (EMI), which is also discussed. Finally, the systems level pros and cons of both AoC and AiP solutions are highlighted from the electrical and economic perspectives for system designers.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Zhang, Yue Ping
Liu, Duixian
format Article
author Zhang, Yue Ping
Liu, Duixian
author_sort Zhang, Yue Ping
title Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
title_short Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
title_full Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
title_fullStr Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
title_full_unstemmed Antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
title_sort antenna-on-chip and antenna-in-package solutions to highly-integrated millimeter-wave devices for wireless communications
publishDate 2010
url https://hdl.handle.net/10356/91623
http://hdl.handle.net/10220/6234
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