Characterizing the interfacial fracture toughness for microelectronic packaging
In a microelectronic package there are many interfaces where the adhesion between different materials plays an important role in its reliability issue. Take an example in a flipchip package: delamination at the interfaces between underfill/passivation, underfill/substrate, etc. will lead to the spee...
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| Main Authors: | , , |
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| 格式: | Article |
| 語言: | English |
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2012
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| 在線閱讀: | https://hdl.handle.net/10356/94042 http://hdl.handle.net/10220/8211 |
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| 機構: | Nanyang Technological University |
| 語言: | English |