Characterizing the interfacial fracture toughness for microelectronic packaging

• المؤلفون الرئيسيون: Chen, W. T., Chen, Zhong, Cotterell, Brian
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94042; http://hdl.handle.net/10220/8211
• المؤسسة: Nanyang Technological University

In a microelectronic package there are many interfaces where the adhesion between different materials plays an important role in its reliability issue. Take an example in a flipchip package: delamination at the interfaces between underfill/passivation, underfill/substrate, etc. will lead to the spee...