Interface fracture toughness assessment of solder joints using double cantilever beam test

• المؤلفون الرئيسيون: Loo, Shane Zhi Yuan, Lee, Puay Cheng, Lim, Zan Xuan, Yantara, Natalia, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94053; http://hdl.handle.net/10220/8215

In the current work, a test scheme to evaluate solder joint interface fracture toughness using double cantilever beam (DCB) test has been successfully demonstrated. The obtained results, in terms of critical energy release rate, predict the joint failure based on the principle of fracture mechanics....