Interface fracture toughness assessment of solder joints using double cantilever beam test

In the current work, a test scheme to evaluate solder joint interface fracture toughness using double cantilever beam (DCB) test has been successfully demonstrated. The obtained results, in terms of critical energy release rate, predict the joint failure based on the principle of fracture mechanics....

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Main Authors: Loo, Shane Zhi Yuan, Lee, Puay Cheng, Lim, Zan Xuan, Yantara, Natalia, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong
其他作者: School of Materials Science & Engineering
格式: Article
語言:English
出版: 2012
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在線閱讀:https://hdl.handle.net/10356/94053
http://hdl.handle.net/10220/8215
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