Stress studies on Ti and TiN interlayer in (100) silicon wafers
Ti is used to improve wettability between Al and Si. TiN is used as a diffusion barrier to prevent diffusion of Al into Si during annealing. In this study, stress from Ti and TiN thin-films on (100) Silicon wafers are studied using Stoney’s equation. [1st Award]
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Student Research Poster |
| Language: | English |
| Published: |
2013
|
| Online Access: | https://hdl.handle.net/10356/94300 http://hdl.handle.net/10220/8945 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |
| id |
sg-ntu-dr.10356-94300 |
|---|---|
| record_format |
dspace |
| spelling |
sg-ntu-dr.10356-943002020-09-27T20:28:11Z Stress studies on Ti and TiN interlayer in (100) silicon wafers Tay, Stephen En Rong Tan Chuan Seng School of Electrical and Electronic Engineering Ti is used to improve wettability between Al and Si. TiN is used as a diffusion barrier to prevent diffusion of Al into Si during annealing. In this study, stress from Ti and TiN thin-films on (100) Silicon wafers are studied using Stoney’s equation. [1st Award] 2013-01-08T08:22:47Z 2019-12-06T18:53:50Z 2013-01-08T08:22:47Z 2019-12-06T18:53:50Z 2010 2010 Student Research Poster Tay, S. E. R. (2010, March). Stress studies on Ti and TiN interlayer in (100) silicon wafers. Presented at Discover URECA @ NTU poster exhibition and competition, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/94300 http://hdl.handle.net/10220/8945 en © 2010 The Author(s). application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| country |
Singapore |
| collection |
DR-NTU |
| language |
English |
| description |
Ti is used to improve wettability between Al and Si. TiN is used as a diffusion barrier to prevent diffusion of Al into Si during annealing. In this study, stress from Ti and TiN thin-films on (100) Silicon wafers are studied using Stoney’s equation. [1st Award] |
| author2 |
Tan Chuan Seng |
| author_facet |
Tan Chuan Seng Tay, Stephen En Rong |
| format |
Student Research Poster |
| author |
Tay, Stephen En Rong |
| spellingShingle |
Tay, Stephen En Rong Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| author_sort |
Tay, Stephen En Rong |
| title |
Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| title_short |
Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| title_full |
Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| title_fullStr |
Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| title_full_unstemmed |
Stress studies on Ti and TiN interlayer in (100) silicon wafers |
| title_sort |
stress studies on ti and tin interlayer in (100) silicon wafers |
| publishDate |
2013 |
| url |
https://hdl.handle.net/10356/94300 http://hdl.handle.net/10220/8945 |
| _version_ |
1681056954547437568 |