Kumar, A., Teo, P. S., He, M., Chen, Z., & Engineering, S. o. M. S. &. (2012). Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder.

Kumar, A., P. S. Teo, Min He, Zhong Chen, و School of Materials Science & Engineering. Effect of Electromigration On Interfacial Reactions between Electroless Ni-P and Sn–3.5% Ag Solder. 2012.

Kumar, A., et al. Effect of Electromigration On Interfacial Reactions between Electroless Ni-P and Sn–3.5% Ag Solder. 2012.