Interfacial reacions of Ni on Si1-xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing

The interfacial reaction of Ni with relaxed Si1-xGex (x=0.2,0.3) films in the low temperature range, viz., 300–500 °C, has been investigated and compared with that of Ni with Si (i.e., x=0)....

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Main Authors: Pey, Kin Leong, Chattopadhyay, Sujay, Lee, Pooi See, Zhao, H. B., Choi, W. K., Antoniadis, D. A., Fitzgerald, Eugene A.
其他作者: School of Materials Science & Engineering
格式: Article
語言:English
出版: 2012
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在線閱讀:https://hdl.handle.net/10356/94799
http://hdl.handle.net/10220/8031
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機構: Nanyang Technological University
語言: English