Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices
The propagation properties of dielectric loaded surface plasmon polariton (DLSPP) waveguide structures have been investigated by using the transfer matrix method (TMM), which is simple and has a fast calculation speed. The results obtained from the TMM agree well with those from the finite element m...
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sg-ntu-dr.10356-948212023-02-28T19:38:20Z Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices He, Xiao Yong Wang, Qi Jie Yu, Siu Fung School of Electrical and Electronic Engineering The propagation properties of dielectric loaded surface plasmon polariton (DLSPP) waveguide structures have been investigated by using the transfer matrix method (TMM), which is simple and has a fast calculation speed. The results obtained from the TMM agree well with those from the finite element method. As a demonstration, we investigate the waveguide properties of DLSPP structures in the terahertz and near-infrared regimes. The TMM is potentially a powerful and effective tool for studying various plasmonic waveguide structures, which may find important applications in integrated photonic devices and sensors. Published version 2013-02-20T02:04:34Z 2019-12-06T19:02:56Z 2013-02-20T02:04:34Z 2019-12-06T19:02:56Z 2012 2012 Journal Article He, X. Y., Wang, Q. J., & Yu, S. F. (2012). Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices. Journal of Applied Physics, 111(7), 073108-. 0021-8979 https://hdl.handle.net/10356/94821 http://hdl.handle.net/10220/9177 10.1063/1.3703468 en Journal of Applied Physics © 2012 American Institute of Physics. This paper was published in Journal of Applied Physics and is made available as an electronic reprint (preprint) with permission of 2012 American Institute of Physics. The paper can be found at the following official DOI: [http://dx.doi.org/10.1063/1.3703468]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. application/pdf |
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The propagation properties of dielectric loaded surface plasmon polariton (DLSPP) waveguide structures have been investigated by using the transfer matrix method (TMM), which is simple and has a fast calculation speed. The results obtained from the TMM agree well with those from the finite element method. As a demonstration, we investigate the waveguide properties of DLSPP structures in the terahertz and near-infrared regimes. The TMM is potentially a powerful and effective tool for studying various plasmonic waveguide structures, which may find important applications in integrated photonic devices and sensors. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering He, Xiao Yong Wang, Qi Jie Yu, Siu Fung |
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He, Xiao Yong Wang, Qi Jie Yu, Siu Fung |
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He, Xiao Yong Wang, Qi Jie Yu, Siu Fung Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
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He, Xiao Yong |
title |
Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
title_short |
Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
title_full |
Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
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Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
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Analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
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analysis of dielectric loaded surface plasmon waveguide structures : transfer matrix method for plasmonic devices |
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2013 |
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https://hdl.handle.net/10356/94821 http://hdl.handle.net/10220/9177 |
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