Thermal bonding of microfluidic devices : factors that affect interfacial strength of similar and dissimilar cyclic olefin copolymers

• Main Authors: Roy, Sunanda, Yue, Chee Yoon, Wang, Z. Y., Anand, L.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/97326; http://hdl.handle.net/10220/12101
• Institution: Nanyang Technological University

Thermal bonding of the same polymer is an important method for obtaining good thermal sealing between two polymeric substrates in microfluidic devices. It is worthwhile to use different grades of the same polymer which have different glass transition temperatures (Tg) because no change in microchann...