Thermal bonding of microfluidic devices : factors that affect interfacial strength of similar and dissimilar cyclic olefin copolymers

• المؤلفون الرئيسيون: Roy, Sunanda, Yue, Chee Yoon, Wang, Z. Y., Anand, L.
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/97326; http://hdl.handle.net/10220/12101

Thermal bonding of the same polymer is an important method for obtaining good thermal sealing between two polymeric substrates in microfluidic devices. It is worthwhile to use different grades of the same polymer which have different glass transition temperatures (Tg) because no change in microchann...