Wong, T. K. S., & Engineering, S. o. E. a. E. (2013). Time dependent dielectric breakdown in copper low-k interconnects: Mechanisms and reliability models.
استشهاد بنمط شيكاغوWong, Terence Kin Shun, و School of Electrical and Electronic Engineering. Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models. 2013.
MLA استشهادWong, Terence Kin Shun, و School of Electrical and Electronic Engineering. Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models. 2013.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.