Time dependent dielectric breakdown in copper low-k interconnects : mechanisms and reliability models

• Main Author: Wong, Terence Kin Shun
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/97782; http://hdl.handle.net/10220/10908
• Institution: Nanyang Technological University

The time dependent dielectric breakdown phenomenon in copper low-k damascene interconnects for ultra large-scale integration is reviewed. The loss of insulation between neighboring interconnects represents an emerging back end-of-the-line reliability issue that is not fully understood. After describ...