Low dielectric constant materials for multilevel interconnect applications

• 主要作者: Wong, Terence Kin Shun.
• 其他作者: Wong Kin Shun, Terence
• 格式: Research Report
• 出版: 2008
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• 在線閱讀: http://hdl.handle.net/10356/2897
• 機構: Nanyang Technological University

Low dielectric constant (low-k) constitutive dielectrics for interconnects have been fabricated by both plasma deposition and solution synthesis from -organosilicon precursors. Fluorinated silicon oxide (FSG) was deposited from an inductively coupled high density plasma. The mechanisms of dielectric...