Low dielectric constant materials for multilevel interconnect applications

• Main Author: Wong, Terence Kin Shun.
• Other Authors: Wong Kin Shun, Terence
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: http://hdl.handle.net/10356/2897
• Institution: Nanyang Technological University

Low dielectric constant (low-k) constitutive dielectrics for interconnects have been fabricated by both plasma deposition and solution synthesis from -organosilicon precursors. Fluorinated silicon oxide (FSG) was deposited from an inductively coupled high density plasma. The mechanisms of dielectric...