Fabrication and characterization of thin film novel materials for microdevices and microsystems

Aluminium and aluminium alloys have been widely used as the interconnection materials to link transistors. Its application in ultra-large scale integration (ULSI) circuits is endorsed because the physical and chemical properties of aluminium are compatible with ULSI processing: Aluminium forms a thi...

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Bibliographic Details
Main Author: Tay, Beng Kang
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/2915
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Institution: Nanyang Technological University