Fabrication and characterization of thin film novel materials for microdevices and microsystems

• Main Author: Tay, Beng Kang
• Other Authors: School of Electrical and Electronic Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• Online Access: http://hdl.handle.net/10356/2915
• Institution: Nanyang Technological University

Aluminium and aluminium alloys have been widely used as the interconnection materials to link transistors. Its application in ultra-large scale integration (ULSI) circuits is endorsed because the physical and chemical properties of aluminium are compatible with ULSI processing: Aluminium forms a thi...