Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

10.1016/j.tsf.2004.05.093

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Bibliographic Details
Main Authors: Ngwan, V.C., Zhu, C., Krishnamoorthy, A.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Cu interconnects
Damascene
Intra-level dielectric leakage
Surface treatment
TDDB
Online Access:http://scholarbank.nus.edu.sg/handle/10635/82214
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/82214

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