Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects
10.1016/j.tsf.2004.05.093
Saved in:
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/82214 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
id |
sg-nus-scholar.10635-82214 |
---|---|
record_format |
dspace |
spelling |
sg-nus-scholar.10635-822142023-10-26T22:01:42Z Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects Ngwan, V.C. Zhu, C. Krishnamoorthy, A. ELECTRICAL & COMPUTER ENGINEERING Cu interconnects Damascene Intra-level dielectric leakage Surface treatment TDDB 10.1016/j.tsf.2004.05.093 Thin Solid Films 462-463 SPEC. ISS. 321-324 THSFA 2014-10-07T04:26:43Z 2014-10-07T04:26:43Z 2004-09 Article Ngwan, V.C., Zhu, C., Krishnamoorthy, A. (2004-09). Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects. Thin Solid Films 462-463 (SPEC. ISS.) : 321-324. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.093 00406090 http://scholarbank.nus.edu.sg/handle/10635/82214 000223812800066 Scopus |
institution |
National University of Singapore |
building |
NUS Library |
continent |
Asia |
country |
Singapore Singapore |
content_provider |
NUS Library |
collection |
ScholarBank@NUS |
topic |
Cu interconnects Damascene Intra-level dielectric leakage Surface treatment TDDB |
spellingShingle |
Cu interconnects Damascene Intra-level dielectric leakage Surface treatment TDDB Ngwan, V.C. Zhu, C. Krishnamoorthy, A. Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
description |
10.1016/j.tsf.2004.05.093 |
author2 |
ELECTRICAL & COMPUTER ENGINEERING |
author_facet |
ELECTRICAL & COMPUTER ENGINEERING Ngwan, V.C. Zhu, C. Krishnamoorthy, A. |
format |
Article |
author |
Ngwan, V.C. Zhu, C. Krishnamoorthy, A. |
author_sort |
Ngwan, V.C. |
title |
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
title_short |
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
title_full |
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
title_fullStr |
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
title_full_unstemmed |
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
title_sort |
effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/82214 |
_version_ |
1781784082678546432 |