Intra-level dielectric reliability in deep sub-micron copper interconnects

Master's

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Bibliographic Details
Main Author: NGWAN VOON CHENG
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/14158
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Institution: National University of Singapore
Language: English