Intra-level dielectric reliability in deep sub-micron copper interconnects

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Main Author:	NGWAN VOON CHENG
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Intra-level Dielectric Reliability, Cu Interconnects, Low-k dielectric, Dielectric Barrier, Surface Treatment, Soft Breakdown.
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/14158
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-14158
record_format	dspace
spelling	sg-nus-scholar.10635-141582015-01-11T14:17:46Z Intra-level dielectric reliability in deep sub-micron copper interconnects NGWAN VOON CHENG ELECTRICAL & COMPUTER ENGINEERING ZHU CHUNXIANG Intra-level Dielectric Reliability, Cu Interconnects, Low-k dielectric, Dielectric Barrier, Surface Treatment, Soft Breakdown. Master's MASTER OF ENGINEERING 2010-04-08T10:40:27Z 2010-04-08T10:40:27Z 2004-08-10 Thesis NGWAN VOON CHENG (2004-08-10). Intra-level dielectric reliability in deep sub-micron copper interconnects. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/14158 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Intra-level Dielectric Reliability, Cu Interconnects, Low-k dielectric, Dielectric Barrier, Surface Treatment, Soft Breakdown.
spellingShingle	Intra-level Dielectric Reliability, Cu Interconnects, Low-k dielectric, Dielectric Barrier, Surface Treatment, Soft Breakdown. NGWAN VOON CHENG Intra-level dielectric reliability in deep sub-micron copper interconnects
description	Master's
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING NGWAN VOON CHENG
format	Theses and Dissertations
author	NGWAN VOON CHENG
author_sort	NGWAN VOON CHENG
title	Intra-level dielectric reliability in deep sub-micron copper interconnects
title_short	Intra-level dielectric reliability in deep sub-micron copper interconnects
title_full	Intra-level dielectric reliability in deep sub-micron copper interconnects
title_fullStr	Intra-level dielectric reliability in deep sub-micron copper interconnects
title_full_unstemmed	Intra-level dielectric reliability in deep sub-micron copper interconnects
title_sort	intra-level dielectric reliability in deep sub-micron copper interconnects
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/14158
_version_	1681078979727982592

Intra-level dielectric reliability in deep sub-micron copper interconnects

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