Impact of buried capping layer on TDDB physics of advanced interconnects

Impact of buried capping layer on TDDB physics of advanced interconnects

IEEE International Reliability Physics Symposium Proceedings

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Bibliographic Details
Main Authors: Yiang, K.Y., Yoo, W.J., Krishnamoorthy, A., Tang, L.J.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Buried capping layer
Interconnects
Low-k
Reliability
Time-dependent dielectric breakdown
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70533
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/70533

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