Intra-level dielectric reliability in deep sub-micron copper interconnects

• Main Author: NGWAN VOON CHENG
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Theses and Dissertations
• Language: English
• Published: 2010
• Subjects: Intra-level Dielectric Reliability, Cu Interconnects, Low-k dielectric, Dielectric Barrier, Surface Treatment, Soft Breakdown.
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/14158
• Institution: National University of Singapore

Master's