Wong, T. K. S., & Engineering, S. o. E. a. E. (2013). Time dependent dielectric breakdown in copper low-k interconnects: Mechanisms and reliability models.
Chicago Style CitationWong, Terence Kin Shun, and School of Electrical and Electronic Engineering. Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models. 2013.
MLA引文Wong, Terence Kin Shun, and School of Electrical and Electronic Engineering. Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models. 2013.
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