APA引文

Nai, S. M. L., Xu, L. Y., Wei, J., Han, Y., Jing, H., Tan, C. M., & Engineering, S. o. E. a. E. (2013). Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes.

Chicago Style Citation

Nai, S. M. L., L. Y. Xu, J. Wei, Yongdian Han, Hongyang Jing, Cher Ming Tan, and School of Electrical and Electronic Engineering. Creep Mitigation in Sn–Ag–Cu Composite Solder With Ni-coated Carbon Nanotubes. 2013.

MLA引文

Nai, S. M. L., et al. Creep Mitigation in Sn–Ag–Cu Composite Solder With Ni-coated Carbon Nanotubes. 2013.