Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router

Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router

We propose 3D mesh-based optical network-on-chip (ONoC) based on a novel low-cost 6×6 optical router, and quantitatively analyze thermal effects on the 3D ONoC. Evaluation results show that with the traditional thermal tuning technique using microheater, the average power efficiency of the 3D ONoC i...

Full description

Saved in:
Bibliographic Details
Main Authors: Ye, Yaoyao, Xu, Jiang, Wu, Xiaowen, Zhang, Wei, Liu, Weichen, Nikdast, Mahdi, Wang, Xuan, Wang, Zhehui, Wang, Zhe
Other Authors: School of Computer Engineering
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
DRNTU::Engineering::Computer science and engineering
Online Access:https://hdl.handle.net/10356/98189
http://hdl.handle.net/10220/12118
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-98189
record_format dspace
spelling sg-ntu-dr.10356-981892020-05-28T07:19:22Z Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router Ye, Yaoyao Xu, Jiang Wu, Xiaowen Zhang, Wei Liu, Weichen Nikdast, Mahdi Wang, Xuan Wang, Zhehui Wang, Zhe School of Computer Engineering IEEE Optical Interconnects Conference (2012 : Santa Fe, US) DRNTU::Engineering::Computer science and engineering We propose 3D mesh-based optical network-on-chip (ONoC) based on a novel low-cost 6×6 optical router, and quantitatively analyze thermal effects on the 3D ONoC. Evaluation results show that with the traditional thermal tuning technique using microheater, the average power efficiency of the 3D ONoC is about 2.7pJ/bit, while chip temperature varies spatially between 55°C and 85°C. In comparison, a new technique using the optimal device setting can improve the average power efficiency to 2.1pJ/bit. It is shown that in this particular case, the effectiveness of the two techniques is comparable. If we apply both techniques at the same time, the average power efficiency can be further improved to 1.3pJ/bit. 2013-07-24T08:03:25Z 2019-12-06T19:51:55Z 2013-07-24T08:03:25Z 2019-12-06T19:51:55Z 2012 2012 Conference Paper Ye, Y., Xu, J., Wu, X., Zhang, W., Liu, W., Nikdast, M., et al. (2012). Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router. 2012 IEEE Optical Interconnects Conference. https://hdl.handle.net/10356/98189 http://hdl.handle.net/10220/12118 10.1109/OIC.2012.6224422 en © 2012 IEEE.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Computer science and engineering
spellingShingle DRNTU::Engineering::Computer science and engineering
Ye, Yaoyao
Xu, Jiang
Wu, Xiaowen
Zhang, Wei
Liu, Weichen
Nikdast, Mahdi
Wang, Xuan
Wang, Zhehui
Wang, Zhe
Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
description We propose 3D mesh-based optical network-on-chip (ONoC) based on a novel low-cost 6×6 optical router, and quantitatively analyze thermal effects on the 3D ONoC. Evaluation results show that with the traditional thermal tuning technique using microheater, the average power efficiency of the 3D ONoC is about 2.7pJ/bit, while chip temperature varies spatially between 55°C and 85°C. In comparison, a new technique using the optimal device setting can improve the average power efficiency to 2.1pJ/bit. It is shown that in this particular case, the effectiveness of the two techniques is comparable. If we apply both techniques at the same time, the average power efficiency can be further improved to 1.3pJ/bit.
author2 School of Computer Engineering
author_facet School of Computer Engineering
Ye, Yaoyao
Xu, Jiang
Wu, Xiaowen
Zhang, Wei
Liu, Weichen
Nikdast, Mahdi
Wang, Xuan
Wang, Zhehui
Wang, Zhe
format Conference or Workshop Item
author Ye, Yaoyao
Xu, Jiang
Wu, Xiaowen
Zhang, Wei
Liu, Weichen
Nikdast, Mahdi
Wang, Xuan
Wang, Zhehui
Wang, Zhe
author_sort Ye, Yaoyao
title Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
title_short Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
title_full Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
title_fullStr Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
title_full_unstemmed Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
title_sort thermal analysis for 3d optical network-on-chip based on a novel low-cost 6×6 optical router
publishDate 2013
url https://hdl.handle.net/10356/98189
http://hdl.handle.net/10220/12118
_version_ 1681056973669269504

Similar Items