A mechanical assessment of flexible optoelectronic devices
This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to e...
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2012
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sg-ntu-dr.10356-987382023-07-14T15:44:55Z A mechanical assessment of flexible optoelectronic devices Chen, Zhong Cotterell, Brian Wang, Wei Guenther, Ewald Chua, Soo Jin School of Materials Science & Engineering DRNTU::Engineering::Materials This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. Accepted version 2012-05-28T09:05:28Z 2019-12-06T19:59:04Z 2012-05-28T09:05:28Z 2019-12-06T19:59:04Z 2001 2001 Journal Article Chen, Z., Cotterell, B., Wang, W., Guenther, E., & Chua, S. J. (2001). A mechanical assessment of flexible optoelectronic devices. Thin solid films, 394(1-2), 201-205. https://hdl.handle.net/10356/98738 http://hdl.handle.net/10220/8159 10.1016/S0040-6090(01)01138-5 en Thin solid films © 2001 Elsevier Science B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Thin Solid Films, Elsevier Science B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: DOI: [http://dx.doi.org/10.1016/S0040-6090(01)01138-5]. 18 p. application/pdf |
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DRNTU::Engineering::Materials Chen, Zhong Cotterell, Brian Wang, Wei Guenther, Ewald Chua, Soo Jin A mechanical assessment of flexible optoelectronic devices |
| description |
This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. |
| author2 |
School of Materials Science & Engineering |
| author_facet |
School of Materials Science & Engineering Chen, Zhong Cotterell, Brian Wang, Wei Guenther, Ewald Chua, Soo Jin |
| format |
Article |
| author |
Chen, Zhong Cotterell, Brian Wang, Wei Guenther, Ewald Chua, Soo Jin |
| author_sort |
Chen, Zhong |
| title |
A mechanical assessment of flexible optoelectronic devices |
| title_short |
A mechanical assessment of flexible optoelectronic devices |
| title_full |
A mechanical assessment of flexible optoelectronic devices |
| title_fullStr |
A mechanical assessment of flexible optoelectronic devices |
| title_full_unstemmed |
A mechanical assessment of flexible optoelectronic devices |
| title_sort |
mechanical assessment of flexible optoelectronic devices |
| publishDate |
2012 |
| url |
https://hdl.handle.net/10356/98738 http://hdl.handle.net/10220/8159 |
| _version_ |
1772829058207318016 |