Experimental and numerical investigations of the texture evolution in copper wire drawing

• Main Authors: Sridhar, Idapalapati, Subbiah, Sathyan, Narayanan, Karthic R.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/99112; http://hdl.handle.net/10220/12566
• Institution: Nanyang Technological University

Polycrystalline copper wires are drawn in a single and multiple step for the equivalent area reduction (RA) of ∼33% The single step and multiple step drawing process was simulated using a rate independent crystal plasticity with finite strain, which is implemented as a user routine in commercial finite element package ABAQUS. The texture of the copper wires were characterized by X-ray diffraction (XRD) and compared with the texture based finite element (FE) simulation predictions. Initial 〈10 0〉 fiber decreases during the drawing process and is replaced by 〈1 1 1〉 fiber. The 〈1 1 1〉 oriented grains are predominant in a single step drawing compared to a multiple step of the equivalent area reduction. The finite element analysis takes into account active crystallographic slip and orientation effects during the drawing process. Regions at the interface of die–wire exhibited complex textures, which was widely seen in the multiple step drawing pattern.